How low can you go?

Many device developers struggle to balance the need for a strong ePTFE cover with the requirement for a low crimping profile.
Currently, ePTFE covering requires a 2-layer coating – AKA, “The Sandwich.” The double layer increases the overall wall thickness and the crimping profile.
Medibrane’s unique suture-less lamination technology makes The Sandwich unnecessary: Only one layer of ePTFE is required for robust and consistent bonding.
This helps us go low in the crimping profile. Very low.

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